Monday, 25 April 8:20 am-9:10 am PDT
Title: Design and Technology Directions to Enable the Zetta-Scale Computing Era
Dr. Eric Karl, Intel Fellow, Director, Advanced Design, Director, Embedded Memory Technology and Circuits, USA
The relentless pace of innovation in the semiconductor industry has led us to the beginning of the exascale compute era in the high-performance computing space. Technologists are charting the course to next generation systems that will reach zeta-scale computing in the not-too-distant future. Power density, energy efficiency, thermal constraints and system cost are challenges to overcome with upcoming technologies and design approaches. In this talk, we will explore the directions in technology that will play a significant role in reaching zeta-scale compute, including next-generation RibbonFET transistors, powerVia interconnects, high-speed and optical interconnects, memory hierarchy innovations and advanced packaging technology. Along the way, I will highlight some of the challenges and opportunities we can see for circuit designers in the coming years.
Dr. Eric Karl is an Intel Fellow, Director of Advanced Design and Director of Embedded Memory Technology and Circuits. Karl leads the Advanced Design group in Intel’s Technology Development organization where he is responsible for standard cell library architecture, memory and analog circuit technologies employed by all designers on Intel technology. Karl leads teams at Intel responsible for design technology co-optimization and develops a wide-range of circuits for early development test vehicles to enable technology development. Karl played a lead role in Intel’s embedded memory technology development and the transition to FinFET technology in 2012. Karl holds a doctorate, master’s and bachelor’s degree in electrical engineering from University of Michigan – Ann Arbor. He has published over 30 peer-reviewed technical papers, holds numerous patents and is currently serving on the memory subcommittee of the International Solid-State Circuits Conference (ISSCC).
Tuesday, 26 April 12:15 pm-1:45 pm PDT
Title: Democratizing IC Design: The Story of a New Movement
Boris Murmann, Professor of Electrical Engineering, Stanford University, USA
Abstract: Over the past several decades, society has strongly benefited from free and open-source software. The open-source spirit has also expanded to hardware and has energized a maker community that collaboratively tinkers with embedded systems at the printed circuit board level. Exciting new developments surrounding the release of SkyWater’s open-source 130 nm-CMOS process design kit (PDK) have now also enabled access to custom chip design and fabrication for anyone.
Inspired by the possibility of open collaboration in IC design, the IEEE Solid-State Circuits Society (SSCS) has launched its new Platform for IC Design Outreach (PICO) in the summer of 2021. With this program, the SSCS intends to build new international communities that share our excitement about IC innovation and its democratization toward a new wave of global impact. This talk will provide an overview of ongoing SSCS PICO activities and review the broader goals of the fast-growing open-source movement.
Boris Murmann is a Professor of Electrical Engineering at Stanford University. He joined Stanford in 2004 after completing his Ph.D. degree in electrical engineering at the University of California, Berkeley in 2003. From 1994 to 1997, he was with Neutron Microelectronics, Germany, where he developed low-power and smart-power ASICs. Since 2004, he has worked as a consultant with numerous Silicon Valley companies. Dr. Murmann’s research interests are in mixed-signal integrated circuit design, with special emphasis on sensor interfaces, data converters, high-speed communication, and machine learning. In 2008, he was a co-recipient of the Best Student Paper Award at the VLSI Circuits Symposium and a recipient of the Best Invited Paper Award at the IEEE Custom Integrated Circuits Conference (CICC). He received the 2009 Agilent Early Career Professor Award, the 2012 Friedrich Wilhelm Bessel Research Award by the Humboldt Foundation, and the 2021 SIA-SRC University Researcher Award for lifetime research contributions to the U.S. semiconductor industry. He has served as an Associate Editor of the IEEE Journal of Solid-State Circuits, an AdCom member and Distinguished Lecturer of the IEEE Solid-State Circuits Society (SSCS), the Data Converter Subcommittee Chair and Technical Program Chair of the IEEE International Solid-State Circuits Conference (ISSCC), as well as the Technical Program Co-Chair of the tinyML Research Symposium. He currently chairs the IEEE SSCS future directions committee (SSCD). He is a Fellow of the IEEE.
Wednesday, 27 April 8:00 am-8:50 am PDT
Title: “RF Transceivers, Pursuing the Endless Frontier”
Reza Rofougaran, CTO / Founder, Movandi, USA
Reza Rofougaran is a leading pioneer, engineering executive, and entrepreneur in wireless system design. He has pioneered research in RF CMOS technology and has led the integration of RF radio with digital processors He was founder of Innovent Systems in 1998, merged with Broadcom in 2000. At Broadcom, he integrated multiple wireless systems into a single chip CMOS enabling smart phones and mobiles devices with Wi-Fi to coexist simultaneously with Bluetooth and other wireless systems. This had a major impact on mobile devices and over 90% of today’s internet traffic and daily wireless connections are based on these integrated chips.
Reza is a Fellow of IEEE and Broadcom Corporation. He was influential in starting and building the wireless business at Broadcom that shipped more than 1.5 billion radios per year. In 2016, he Co-founded Movandi Corporation to develop a systems solution to 5G wireless network technology
in 2018, he received the IEEE Industrial Pioneer award for research in RF CMOS and its utilization as a radio-on-chip that enables today’s smartphones. He was also recognized by UCLA as an inventor and pioneering figure in the wireless communications industry with recognition as UCLA’s 2018 Alumnus of the Year award. In 2018, DARPA published a report on the national economic impacts of DOD funded program from 1995-2018. According to DARPA repot “Reza Rofougaran developed integrated networking chips that still drive’s the lion share of today’s wireless technology.
In February 2020, he was elected to be a member of National Academy of Engineering for his contributions to the development of system-on-chip for wireless communication.
He is one of the top 50 patent holders in the world. Reza holds about 900 issued patents.