April 21 – 24, 2024 – Denver, Colorado, USA
The IEEE Custom Integrated Circuits Conference (CICC) stands as a premier event dedicated to research and development in the field of Integrated Circuits. In 2024, we mark the 35th year of operation, presenting original and groundbreaking work on analog and digital circuit and system techniques, covering a broad spectrum of technical topics.
CICC serves as a vital forum for analog mixed-signal IC and SoC designers, CAD developers, IC foundries and manufacturers, technology providers, and ASIC users. The CICC community has been steadily growing, with a record-breaking virtual attendance of over 530 industry professionals, faculty, and students from all regions worldwide in 2021. The following year, in 2022, we transitioned to a hybrid event with 342 registrants. Returning to normalcy in 2023, we embraced in-person participation.
CICC boasts a comprehensive technical program featuring over 130 lecture presentations and 16 educational sessions, providing professionals with insights into recent advances in IC state-of-the-art. The conference also incorporates forums and panel discussions, facilitating interaction among peers.
What’s New: A Chiplet Workshop will be offered by IEEE-SSCS, in cooperation with IEEE-CICC, on April 25, 2024.
| Our sponsors play a fundamental role in CICC, making the conference possible. They not only facilitate the attendance of top students but also promote education, cooperation, and contribute directly to the long-term future of our industry. The sponsorship program ensures that your company’s name is prominently featured in front of the most influential figures from both industry and academia. By supporting this premier IC design conference, you showcase strong leadership and community involvement. This brochure outlines some of the available sponsorship options.
If you are interested in becoming a sponsor, please contact the CICC 2024 Sponsorship Chair, Shenggao Li, at victorli@tsmc.com or Co-Chair, Divya Prasad at divya.prasad@amd.com; |
Sponsorship Opportunities
CICC offers diverse opportunities for companies to demonstrate their commitment to the technical and scientific community. Sponsors receive individual recognition through various channels and formats.
Sponsorship Levels and Benefits:
4 levels of sponsorships are available.
| Amount | Sponsorship Level | Publicity and brand recognition on CICC publications & www.ieee-cicc.org | Recognized in specific sponsored events |
| >$15,000 | Platinum | Sponsor company Logo and Name displayed as Platinum Sponsor | Company Name and Logo will be shown exclusively in specific events selected by sponsors. For example, if a sponsor funds a keynote speech event, the sponsor company Logo/Name will be displayed to all participants. |
| >$10,000 | Gold | Sponsor company Logo and Name displayed as Gold Sponsor | |
| >$5,000 | Silver | Sponsor company Logo and Name displayed as Silver Sponsor | |
| >$3,000 | Bronze | Sponsor company Logo and Name displayed as Bronze Sponsor |
Specific Sponsorship Events
| Events | Opportunities (note1) | Amounts/each |
| General Conference | 1 | $15,000 |
| Keynote Speeches | 2 | $5,000 |
| Keynote Lunch | 1 | $5,000 |
| Education Sessions | 4 (note2) | $5,000 |
| Forum Sessions | 4 | $2,500 |
| Technical Sessions | x long y short (note3) | long $2,500, short $1,500 |
| Overall outstanding Paper Awards | 1 | $7,500 |
| Outstanding Paper Awards | 4 | $5,000 |
Note 1: A sponsor company may request to sponsor one or more specific sessions, such as ADCs or wireline IOs, on a first-come, first-serve basis. Alternatively, they can choose to sponsor more prestigious events, such as a keynote speech by an invited speaker.
Note 2: An education session typically spans a day, featuring multiple speakers who provide tutorials.
Note 3: A long technical session typically lasts for 3.5 hours, while a short technical session lasts for 2 hours. Both sessions include 6-8 presentations.
| 2024 CICC Technical Sessions (reference only) | Subcommittee | Short/Long Session |
| Sunday, April 21 | ||
| Educational Session 1: Deep Learning and Compute-in-Memory Designs and Applications | Digital Circuits | Long |
| Educational Session 2: Introduction to Quantum Computing for Circuit Designers | Foundation of System Design | Long |
| Educational Session 3: Optical and Wireline Communications Circuit Techniques | Wireline | Long |
| Education Session 4: Nascent Sensing Devices and Interfaces | Emerging Technologies | Long |
| Monday, 22 April (Bold/Italic – sponsor confirmed) | ||
| Session 1: Keynote Session – Tsung-Yung Jonathan Chang | Keynote | Short |
| Session 2: Panel: Cognitive Connections: Exploring Brain-Computer-Interfaces through Systems and Experiments | Emerging Technologies | Short |
| Session 3: Forum: AI-based Chip/Chiplet Generation | Foundation of System Design | Short |
| Session 4: Forum: Cutting-edge Energy Harvesting Interface Circuits & Systems | Power Management | Short |
| Session 5: Advances in RF/mmWave Wireless Transceivers | Wireless Transceivers | Short |
| Session 6: Panel: Will open source design be the future direction? | Data Converters | Short |
| Session 7: Mixed-Signal Compute in Memory | Digital Circuits | Long |
| Session 8: Emerging Systems and Integration Techniques | Foundation of System Design | Long |
| Session 8b: Panel: Can Academia Effectively Participate in Heterogeneous Integration Research and How? | Foundation of System Design | Short |
| Session 9: Power Management Techniques | Power Management | Long |
| Session 10: mmWave and THz Circuits and Systems | Wireless Transceivers | Long |
| Session 11: Emerging Computing Technologies and Applications | Emerging Technologies | Long |
| Session 12: High-voltage and Dynamic Comparators | Analog | Short |
| Session 13: Analog Sensor Interfaces | Analog | Short |
| Tuesday, 23 April | ||
| Session 14: Domain-Specific Accelerators | Digital Circuits | Long |
| Session 15: Innovations in Sensing, Communication, and Imaging Technologies | Emerging Technologies | Long |
| Session 16: Energy Harvesting and Isolated Power Conversion | Power Management | Long |
| Session 17: RF/mm-Wave VCO and Phase Locked Loops | Wireless Transceivers | Long |
| Session 18: Power Efficient and Application-Oriented ADCs | Data Converters | Long |
| Session 19: Keynote Luncheon – Noah Sturcken | Keynote | Short |
| Session 20: Digital Circuit Techniques | Digital Circuits | Long |
| Session 21: Machine Learning and Vision Processing Systems | Foundation of System Design | Long |
| Session 22: DC-DC Converters | Power Management | Long |
| Session 23: Wireline Transceivers and Clocking Techniques | Wireline | Long |
| Session 24: High-Resolution ADCs | Data Converters | Long |
| Wednesday, 24 April | ||
| Session 25: Keynote Session – Suman Datta | Keynote | Short |
| Session 26: Digital Compute in Memory | Digital Circuits | Long |
| Session 27: Advanced Neural Interfaces | Emerging Technologies | Long |
| Session 28: High-Speed Data Converters | Data Converters | Long |
| Session 29: Energy-efficient Radios for IoT and Emerging Systems | Wireless Transceivers | Short |
| Session 30: Optical Transceivers and Building Blocks | Wireline | Long |
| Session 31: Panel: How can LLMs help hardware design and will it replace digital design roles in the years to come? | Digital Circuits | Short |
| Session 32: Emerging Systems and Integration Techniques (Part 2) | Foundation of System Design | Short |
| Session 33: Timing References | Analog | Short |
| Session 34: Forum: Wireless Transceivers Towards Next G | Wireless Transceivers | Short |
| Session 35: Forum: Circuits and Packaging Techniques for Next-gen Wireline Communications | Wireline | Short |
| General Conference | ||
| Overall Outstanding Paper | ||
| Outstanding Paper 1 | ||
| Outstanding Paper 2 | ||
| Outstanding Paper 3 | ||
| Outstanding Paper 4 |
CICC 2024 Sponsorship Acknowledgement
(As of 3/26/2024)
| Platinum | TSMC
[Conference Sponsor] |
| Gold | Qualcomm |
| Silver | Texas Instruments |
| AMD | |
| Analog Devices | |
| Etopus | |
| Ansys | |
| Samsung | |
| Synopsys | |
| Muse Semiconductor | |
| Lorentz solution | |
| Bronze | Futurewei |
| Siemens EDA |
