Silver Sponsors
2025 CICC Sponsors
Bronze Sponsors
Sponsor an Event or Promotional Item at CICC
April 13 – 16, 2025 – Boston, MA, USA
The IEEE Custom Integrated Circuits Conference (CICC) is a premier conference devoted to Integrated Circuit research & development. 2025 will be the 36th year of operation, showcasing original, first-published innovative work on analog & digital circuit & system techniques covering a broad spectrum of technical topics.
CICC is a forum for analog mixed-signal IC and SoC designers, CAD developers, IC foundries and manufacturers, technology providers and ASIC users. The CICC community is growing and in 2024 we had a record-breaking attendance of over 500 industry professionals, faculty and students from all regions in the world.
CICC features a technical program with over 130 lecture presentations and 16 educational presentations that will bring professionals up to speed with recent advances in IC state-of-the-art. The conference also includes forums and panel discussions, for peers to interact with each other.
Our sponsors are a fundamental part of CICC. They make the conference possible, help top students attend, promote education and cooperation, and contribute directly to the long-term future of our industry.
The sponsorship program gets your company’s name in front of the most influential people from industry and academia. By supporting this foremost IC design conference, you demonstrate great leadership and community involvement. This brochure highlights some of the available options.
If you are interested in becoming a sponsor, please contact the CICC 2025 Sponsorship Chair, Henry Park, at or Co-Chair, Gregory Chen ().
Sponsorship Opportunities
CICC provides a range of opportunities for companies to show their commitment to the technical and scientific community. Sponsors are individually recognized by name in a variety of ways.
Sponsorship Levels and Benefits:
4 levels of sponsorships are available.
| Amount | Sponsorship Level | Publicity and brand recognition on CICC publications & www.ieee-cicc.org | Banner display | Recognized in specific sponsored events |
| >$15,000 | Platinum | Sponsor company Logo and Name shown as Platinum Sponsor | Banner in hallway | Company Name and Logo will be shown exclusively in specific events selected by sponsors. For example, if a sponsor funds a keynote speech event, the sponsor company Logo/Name will be displayed to all participants. |
| >$10,000 | Gold | Sponsor company Logo and Name shown as Gold Sponsor | Banner in hallway | |
| >$5,000 | Silver | Sponsor company Logo and Name shown as Silver Sponsor | N/A | |
| >$3,000 | Bronze | Sponsor company Logo and Name shown as Bronze Sponsor | N/A |
*Special info session package (new in CICC 2025)
Sponsors with Bronze level and above can contribute extra $2,500 and join a special info session on Tuesday evening (4/15). The package includes one poster display stand, one table (6 feet), and one CICC registration waiver for Tuesday evening session only. For more details, please contact sponsor chair Henry Park ().
Specific Sponsorship Events
| Events | Opportunities | Amounts/each | |
| General Conference | 1 | $15,000 | |
| Keynote Speeches | 2 | $5,000 | |
| Keynote Lunch | 1 | $5,000 | |
| Technical | Education Sessions | 4 | $5,000 |
| Forum Sessions | 4 | $2,500 | |
| Panel Sessions | 4 | $2,500 | |
| Paper Sessions | 18 long 7 short | long $2,500, short $1,500 | |
| Overall outstanding Paper Awards | 1 | $7,500 | |
| Outstanding Paper Awards | 4 | $5,000 | |
*A sponsor company may request to sponsor one or more specific technical sessions, for example, Data converters in regular paper sessions or any topics in Forum/Panel/Education sessions, on a first come first serve basis, or sponsor those more prestigious events such as a keynote speech by an invited speaker.
*An education session typically lasts for a day with multiple speakers giving tutorials.
*A long/short technical session typically lasts for 3.5/2 hours respectively, with 6-8 presentations.
| 2024 CICC Technical sessions (2025 program is WIP) | Subcommittee | Short/Long session | Sponsor |
| High-voltage and Dynamic Comparators | Analog | Short | |
| Analog Sensor Interfaces | Analog | Short | |
| Timing References | Analog | Short | |
| Power Efficient and Application-Oriented ADCs | Data Converters | Long | |
| High-Resolution ADCs | Data Converters | Long | |
| High-Speed Data Converters | Data Converters | Long | |
| Mixed-Signal Compute in Memory | Digital Circuits | Long | |
| Emerging Systems and Integration Techniques (part 1, part 2) | Digital Circuits | Short | |
| Domain-Specific Accelerators | Digital Circuits | Long | |
| Digital Circuit Techniques | Digital Circuits | Long | |
| Machine Learning and Vision Processing Systems | Digital Circuits | Long | |
| Digital Compute in Memory | Digital Circuits | Long | |
| Emerging Computing Technologies and Applications | Emerging Tech | Long | |
| Innovations in Sensing, Communication, and Imaging Technologies | Emerging Tech | Long | |
| Advanced Neural Interfaces | Emerging Tech | Long | |
| Energy-efficient Radios for IoT and Emerging Systems | Emerging Tech | Short | |
| Power Management Techniques | Power Management | Long | |
| Energy Harvesting and Isolated Power Conversion | Power Management | Long | |
| DC-DC Converters | Power Management | Long | |
| Advances in RF/mmWave Wireless Transceivers | Wireless | Short | |
| mmWave and THz Circuits and Systems | Wireless | Long | |
| RF/mm-Wave VCO and Phase Locked Loops | Wireless | Long | |
| Wireline Transceivers and Clocking Techniques | Wireline | Long | |
| Optical Transceivers and Building Blocks | Wireline | Long | |
| Wireless Transceivers Towards Next G | Forum | Short | |
| Circuits and Packaging Techniques for Next-gen Wireline Communications | Forum | Short | |
| AI-based Chip/Chiplet Generation | Forum | Short | |
| Cutting-edge Energy Harvesting Interface Circuits & Systems | Forum | Short | |
| Cognitive Connections: Exploring Brain-Computer-Interfaces through Systems and Experiments | Panel | Short | |
| Will open source design be the future direction? | Panel | Short | |
| Can Academia Effectively Participate in Heterogeneous Integration Research and How? | Panel | Short | |
| How can LLMs help hardware design and will it replace digital design roles in the years to come? | Panel | Short | |
| Deep Learning and Compute-in-Memory Designs and Applications | Education | Long | |
| Introduction to Quantum Computing for Circuit Designers | Education | Long | |
| Optical and Wireline Communication Circuit Techniques | Education | Long | |
| Nascent Sensing Devices and Interfaces | Education | Long |
CICC 2024 Sponsorship Acknowledgement
(As of 9/5/2024)
| Platinum | TSMC [Conference Sponsor] |
| Gold | Qualcomm |
| Silver | Texas Instruments |
| AMD | |
| Analog Devices | |
| Etopus | |
| Ansys | |
| BlueCheetah | |
| LorentzSolution | |
| Muse Semiconductor | |
| Samsung | |
| Synopsys | |
| Bronze | Futurewei |
| Siemens EDA |
