Technical Committees
Analog Circuits and Techniques
Chair: Ping-hsuan Hsieh, National Tsing Hua University
Co-chair: Anne-Johan Annema, University of Twente
Committee Members:
Devrim Aksin, ADI
Edoardo Bonizzoni, University Of Pavia
David Duarte, Intel
Soo Youn Kim, Dongguk University
Antonio Liscidini, University of Toronto
Chilun Lo, Mediatek
Jorge Marin, Advanced Center for Electrical and Electronic Engineering, Chile
Nazanin Neshatvar, University College London
Linxiao Shen, Peking University
Biomedical Technologies and Applications
Chair: Chul Kim, KAIST
Co-Chair: Sungwon Chung, Neuralink
Committee Members:
Youngcheol Chae, Yonsei University, Seoul Korea
Yaoyao Jia, University Of Texas At Austin
Kyeongha Kwon, KAIST
Shih-Chii Liu, University of Zurich and ETH Zurich
Kiichi Niitsu, Kyoto University
Sahil Shah, University of Maryland
Constantine Sideris, University of Southern California
Soner Sonmezoglu, Northeastern University
Jiawei Xu, Fudan University
Kaiyuan Yang, Rice University
Xiaolin Yang, IMEC
Data Converters
Chair: Qiang Li, University of Electronic Science and Technology of China
Co-Chair: Sai-Weng Sin, University of Macau
Committee Members:
Thomas Brown, Intel
Chia-hung Chen, National Yang Ming Chiao Tung University
Friedel Gerfers, TU Berlin
Lu Jie, Tsinghua University
Jin-tae Kim, Konkuk University
Martin Kinyua, TSMC
Shaolan Li, Georgia Institute of Technology
Yong Lim, Samsung
Yong Liu, Broadcom
Zhichao Tan, Zhejiang University
Haiyang (Henry) Zhu, ADI
Digital Circuits, SoCs, and Systems
Chair: Divya Prasad, AMD
Co-Chair: Visvesh Sathe, Georgia Institute of Technology
Committee Members:
Behnam Amelifard, Qualcomm
Ningyuan Cao, University of Notre Dame
Muya Chang, NVIDIA
Gregory Chen, Intel Corporation
Jie Gu, Northwestern University
Bongjin Kim, University of California, Santa Barbara
Sukhan Lee, Samsung
Yoonmyung Lee, Sungkyunkwan University
Ashwin Lele, TSMC
Weiwei Shan, Southeast University
Elkim Roa, Samsung Semiconductor
Thierry Tambe, Sanford University
Shanshan Xie, Intel
Jong-Hyeok Yoon, DGIST
Emerging Technologies
Chair: Win-san (Vince) Khwa, TSMC
Co-Chair: Andrea Ruffino, ETH Zurich
Committee Members:
Guillaume Prenat, CEA, France
Tathagata Srimani, Carnegie Mellon University
Kevin Tien, IBM
Liqiong Wei, Intel
Juhwan Yoo, Google Quantum AI
Power Management
Chair: Hyun-Sik Kim, KAIST
Co-Chair: Cheng Huang, Iowa State University
Committee Members:
Mo Huang, University of Macau
Xiaocheng Jing, Qualcomm
Suhwan Kim, Intel
Min-Woo Ko, Intel of Canada
Inhee Lee, University of Pittsburgh
Mauro Leoncini, Politecnico di Milano
Raveesh Magod, Texas Instruments
Sriharsh Pakala, NXP Semiconductors
Edevaldo Pereira, NXP Semiconductors
Alan Roth, TSMC
Systems and Security
Chair: Zhengya Zhang, University of Michigan
Co-Chair: Siddharth Joshi, University of Notre Dame
Committee Members:
Baibhab Chatterjee, University of Florida
Debayan Das, Indian Institute of Science
Xinfei Guo, Shanghai Jiao Tong University
Mingu Kang, UCSD
Monodeep Kar, IBM
Raghavan Kumar, Intel
Farhana Sheikh, Intel
Wireless Transceivers and RF/mm-Wave Circuits and Systems
Chair: Sudipto Chakraborty, IBM
Co-Chair: Renzhi Liu, Intel
Committee Members:
Hamidreza Agahsi, University of California Irvine
Ritesh Bhat, Intel
Taiyun Chi, Rice University
Wei Deng, Tsinghua University
Hsieh-hung Hsien, TSMC
Vadim Isssakov, Braunschweig University of Technology
Sachin Kalia, TI
Somnath Kundu, AMD
Aravind Nagulu, Washington University in St. Louis
Mark Oude Alink, University of Twente
Mustafijur Rahman, IIT Delhi
Hamed Rahmani, New York University
Padmanava Sen, Barkhausen-Institut
Tong Zhang, Google
Wireline and Optical Communications Circuits and Systems
Chair: Tejasvi Anand, Oregon State University
Co-Chair: Shenggao (victor) Li, TSMC
Committee Members:
Ajay Balankuty, Intel
Xi Chen, Nvidia
Tawifq Musah, The Ohio State University
Quan Pan, Southern University of Sicence and Technology, China
Henry Park, MediaTek
Luca Ravezzi, AMD
Armin Tajalli, University of Utah
Haitao Tong, Broadcom