Analog Circuits and Techniques

Chair: Ping-hsuan Hsieh, National Tsing Hua University

Co-chair: Anne-Johan Annema, University of Twente

Committee Members:

Devrim Aksin, ADI
Edoardo Bonizzoni, University Of Pavia
David Duarte, Intel
Soo Youn Kim, Dongguk University
Antonio Liscidini, University of Toronto
Chilun  Lo, Mediatek
Jorge Marin, Advanced Center for Electrical and Electronic Engineering, Chile
Nazanin Neshatvar, University College London
Linxiao Shen, Peking University

Biomedical Technologies and Applications

Chair: Chul Kim, KAIST

Co-Chair: Sungwon Chung, Neuralink

Committee Members:

Youngcheol Chae, Yonsei University, Seoul Korea
Yaoyao Jia, University Of Texas At Austin
Kyeongha Kwon, KAIST
Shih-Chii Liu, University of Zurich and ETH Zurich
Kiichi Niitsu, Kyoto University
Sahil Shah, University of Maryland
Constantine Sideris, University of Southern California
Soner Sonmezoglu, Northeastern University
Jiawei  Xu, Fudan University
Kaiyuan Yang, Rice University
Xiaolin Yang, IMEC

Data Converters

Chair: Qiang Li, University of Electronic Science and Technology of China

Co-Chair: Sai-Weng Sin, University of Macau

Committee Members:

Thomas Brown, Intel
Chia-hung Chen, National Yang Ming Chiao Tung University
Friedel  Gerfers, TU Berlin
Lu Jie, Tsinghua University
Jin-tae Kim, Konkuk University
Martin Kinyua, TSMC
Shaolan Li, Georgia Institute of Technology
Yong Lim, Samsung
Yong Liu, Broadcom
Zhichao Tan, Zhejiang University
Haiyang (Henry) Zhu, ADI

Digital Circuits, SoCs, and Systems

Chair: Divya Prasad, AMD

Co-Chair: Visvesh Sathe, Georgia Institute of Technology

Committee Members:

Behnam Amelifard, Qualcomm
Ningyuan Cao, University of Notre Dame
Muya Chang, NVIDIA
Gregory Chen, Intel Corporation
Jie Gu, Northwestern University
Bongjin Kim, University of California, Santa Barbara
Sukhan  Lee, Samsung
Yoonmyung Lee, Sungkyunkwan University
Ashwin Lele, TSMC
Weiwei Shan, Southeast University
Elkim Roa, Samsung Semiconductor
Thierry Tambe, Sanford University
Shanshan Xie, Intel
Jong-Hyeok Yoon, DGIST
Sumanth Kamineni, Nvidia

Emerging Technologies

Chair: Win-san (Vince) Khwa, TSMC

Co-Chair: Andrea Ruffino, ETH Zurich

Committee Members:

Guillaume Prenat, CEA, France
Tathagata Srimani, Carnegie Mellon University
Kevin Tien, IBM
Liqiong Wei, Intel
Juhwan Yoo, Google Quantum AI

Power Management

Chair:  Hyun-Sik Kim, KAIST

Co-Chair: Cheng Huang, Iowa State University

Committee Members:

Mo Huang, University of Macau
Xiaocheng Jing, Qualcomm
Suhwan Kim, Intel
Min-Woo Ko, Intel of Canada
Inhee Lee, University of Pittsburgh
Mauro  Leoncini, Politecnico di Milano
Raveesh Magod, Texas Instruments
Sriharsh Pakala, NXP Semiconductors
Edevaldo Pereira, NXP Semiconductors
Alan Roth, TSMC

Systems and Security

Chair: Zhengya Zhang, University of Michigan

Co-Chair: Siddharth Joshi, University of Notre Dame

Committee Members:

Baibhab Chatterjee, University of Florida
Debayan Das, Indian Institute of Science
Xinfei Guo, Shanghai Jiao Tong University
Mingu Kang, UCSD
Monodeep Kar, IBM
Raghavan Kumar, Intel
Farhana Sheikh, Intel

Wireless Transceivers and RF/mm-Wave Circuits and Systems

Chair: Sudipto Chakraborty, IBM

Co-Chair: Taiyun Chi, Rice University

Committee Members:

Hamidreza Agahsi, University of California Irvine
Ritesh Bhat, Intel
Najme Ebrahimi, Northeastern University
Wei Deng, Tsinghua University
Hsieh-hung Hsien, TSMC
Vadim Isssakov, Braunschweig University of Technology
Sachin Kalia, TI
Somnath Kundu, AMD
Aravind  Nagulu, Washington University in St. Louis
Mark Oude Alink, University of Twente
Mustafijur Rahman, IIT Delhi
Hamed Rahmani, New York University
Padmanava Sen, Barkhausen-Institut
Tong Zhang, Google

Wireline and Optical Communications Circuits and Systems

Chair: Tejasvi Anand, Oregon State University

Co-Chair: Shenggao (victor) Li, TSMC

Committee Members:

Ajay Balankuty, Intel
Xi Chen, Nvidia
Tawifq Musah, The Ohio State University
Quan Pan, Southern University of Sicence and Technology, China
Henry Park, MediaTek
Luca Ravezzi, AMD
Armin Tajalli, University of Utah
Haitao Tong, Broadcom