Topics of Interest

Topics of Interest

CICC 2023 presents papers in the following areas:

Analog Circuits and Techniques and building blocks such as amplifiers, comparators, frequency generation and clocking circuits, filters, references, and nonlinear signal processing circuits.

Data Converters including Nyquist and oversampled A/D, D/A, timeto-digital, frequency-to-digital, and analog-to-information converters of all types driven by new techniques, architectures, technologies or applications.

Digital Circuits, SoCs, and Systems for papers with IC prototypes in technologies that enhance the efficiency, performance, reliability or security of integrated systems. Areas of interest include, but are not limited to, processors, accelerators, interconnect fabrics, memory and foundational hardware design building blocks with associated tools, techniques, and methodologies in advanced nodes. Circuit and architecture co-design for domain-specific applications such as AI, cloud computing, autonomous transportation, low-temperature computing, quantum computing circuits, genome sequencing, sensing, edge computing, and communication are also of interest.

Emerging Technologies, Systems, and Applications with hardwarefocused papers in the technologies of tomorrow extending from a new device to system integration and applications with a focus on, but not limited to:
Next-generation technology and sensors including devices, integration, and packaging including nano-primitives, non-siliconbased technology, and advanced assembly. Sensor interfaces for MEMS, mm-wave/THz, flexible, printed, large-area and organic electronics, electronic-photonic co-design, and silicon photonics. Emerging computing paradigms including photonic and quantum computing hardware, and AL/ML utilizing new devices, analog, and mixed-signal circuits
Biomedical circuits, systems, and applications including neural interfaces, microarrays, lab-on-a-chip, bio-inspired circuits, implantable and/or wearable systems, closed-loop systems with sensing and actuation, medical imaging, and other biosensors including biomedical signal processing SoCs, AI/Machine-Learning for mixed-signal/sensing.

Foundation of System Design (New This Year) with research topics that show innovations in system design, which extend beyond a single integrated circuit. The platforms which can benefit from such innovations are, for example, commercially available programmable hardware such as FPGAs, neuromorphic platforms such as Intel Loihi and IBM TrueNorth, quantum platforms such as D-wave, IBM quantum composer, to name a few. The applications that can be mapped onto such hardware platforms can belong to the following categories include, but are not limited to, the Internet of Things, Biomedical applications, Machine Learning, Big Data management and Autonomous Driving Assistance Systems, Robotics and Secure Systems.

Power Management circuits and design techniques for papers on switched-mode integrated converters using inductive, capacitive, and hybrid architectures, energy harvesting circuits, wireless power transfer, power management circuits for automotive applications, linear regulators, control and management circuits, circuit techniques with novel wide-bandgap devices and drivers, and other methods to improve system overall efficiency and performance.

Wireless Transceivers and RF/mm-Wave Circuits and Systems for low-power, energy-efficient and high performance wireless links, biomedical and sensing networks, IoT applications, cellular connectivity including M2M applications (LTE-M, NB-IoT), emerging broadband and MIMO networks (5G, WLAN), vehicle-to-vehicle (V2V), millimeter-wave & THz systems (radar, sensing and imaging), frequency synthesis and LO generation.

Wireline and Optical Communication Circuits and Systems in areas including serial and parallel links for intra-chip and chip-to-chip interconnections, memory and graphics interfaces, backplanes, long-haul, power line communications, 2.5/3D interconnect and chiplet based solutions including packaging; novel I/O circuits and signaling methods, clocking techniques including PLLs and CDRs; components such as equalizers, ADC/DAC/DSP-based transceivers, silicon photonics and optical interface circuitry for pluggable and co-packaged optics.