2026 CICC Sponsors
Sponsor an Event or Promotional Item at CICC
April 19 – 22, 2026 – Seattle, WA, USA
The IEEE Custom Integrated Circuits Conference (CICC) is a premier conference devoted to Integrated Circuit research and development. In 2026 the 37th year of CICC will showcase newly developed, innovative work on analog and digital techniques covering a broad spectrum of circuit and system topics.
CICC is a forum for IC and SoC designers, CAD developers, IC foundries and manufacturers, technology providers, and ASIC users. The CICC community is growing with an incredible attendance of over 400 industry professionals, professors, and students from around the world in 2025.
CICC features a technical program with over 150 lecture presentations and 12 educational presentations that will bring professionals up to speed with recent advances in IC state-of-the-art. The conference also includes forums and panel discussions, for discussions and interactions between CICC participants.
Sponsors like you are a fundamental part of CICC. You make the conference possible, help top students attend, promote education and cooperation, and contribute directly to the long-term future of our industry.
CICC sponsorship can improve your company’s brand recognition and recruiting efforts by increasing visibility with the many talented engineers and influential leaders attending the conference. Supporting this IC design conference demonstrates strong corporate leadership and community involvement. This brochure highlights the many ways your company and CICC can work together.
If you are interested in becoming a sponsor, please contact the CICC 2026 Sponsorship Chair Gregory Chen ()
Sponsorship Opportunities
CICC provides a range of opportunities for companies to show their commitment to the technical and scientific community. Sponsored events will exclusively display your company’s name and logo. Your contributions from sponsored events will be added together, displayed as your company’s sponsorship level, and provide opportunities to bring a display to the conference atrium. All sponsoring companies will be listed on the CICC website, advance program, and LinkedIn promotional materials. All sponsoring companies will be announced before the Keynote presentations and thanked on slides at the beginning of all technical sessions.
Sponsorship Levels and Benefits:
Total Contribution | Sponsorship Level | Banner display |
$15,000+ | Platinum | Booth display in atrium |
$10,000 – $14,999 | Gold | ~4’ x 10’ banner in atrium |
$5,000 – $9,999 | Silver | ~2’ x 6’ banner in atrium |
$3,000 – $4,999 | Bronze | N/A |
Sponsored Events
Sponsor technical sessions at CICC. Educational Sessions on Sunday inform professionals and students about the current state of fundamental IC design topics. Forums bring in experts to share the very latest developments in important areas. Panels provide an opportunity for CICC attendees to interact with leaders in the field. Regular sessions show new work on specific fields within IC design. ($2,500 for long sessions, $1,500 for short sessions) | ||
2025 CICC Technical sessions | Subcommittee | Short/Long |
Analog Building Blocks and Sensing Circuits | Analog | Short |
Advancements in Low-Power, High-Performance Analog Sensing and Interface Technologies | Analog | Short |
Innovations in High-Performance Analog and Mixed-Signal Circuit Design | Analog | Short |
Advanced Biopotential Interfaces | Biomedical | Long |
Communication Computing and Sensing Techniques in Biomedical Systems | Biomedical | Long |
ASIC and Accelerators | Digital Circuits | Long |
Digital Compute-in-Memory | Digital Circuits | Long |
Machine Learning and Energy Efficient SoCs | Digital Circuits | Long |
Incremental ADCs | Data Converters | Short |
High-Speed Nyquist ADCs | Data Converters | Short |
Continuous-Time ADCs | Data Converters | Short |
High-Resolution and Noise-Shaping ADCs | Data Converters | Long |
Emerging Paradigms for AI, HPC, and Edge Computation | Emerging Tech | Long |
Cryogenic and Silicon Photonic ICs | Emerging Tech | Short |
SC-based Power Conversion | Power Management | Short |
Power Converter Techniques | Power Management | Long |
Application-Specific Power Management | Power Management | Long |
Hybrid DC-DC Converters | Power Management | Long |
Next-Generation Systems: From Datacenters to the Edge | Systems | Short |
Next-Generation Systems: Hardware for Quantum and Secure Computing | Systems | Short |
Advancing System Designs with Chiplet Technology (CICC/CHISIC) | Systems | Long |
Voltage Controlled Oscillators and Power Amplifiers | Wireless | Short |
Advancements in Low-Power Wireless Technologies | Wireless | Short |
High Performance Transceivers | Wireless | Long |
Design Techniques for RF/mmWave CMOS Phased-Locked Loops | Wireless | Long |
High-speed Wireline and Optical Communication | Wireline | Long |
Energy Efficient Wireline Interconnects | Wireline | Short |
Hardware and Architectural Strategies for Building Cutting-edge AI Platforms | Forum | Short |
Potential of Open Source Design for Analog/Mixed Signal IC Education | Forum | Short |
Emerging Techniques for Phase Locked Loops | Forum | Short |
Probabilistic Computing | Forum | Short |
Do we really need a linear-gain amplifier anymore? | Panel | Short |
mmWave/THz Design: A New Paradigm or a Repeat of History with Faster Transistors? | Panel | Short |
Wireline and Lightwave Interconnects – The Shifting Boundary in the AI Era | Panel | Short |
The Impact of AI: A Job Creator or Destroyer? | Panel | Short |
Mastering LLMs: A Deep Dive into Software Models, Hardware Challenges, Security and Reliability | Education | Long |
High Precision Converters and Digital Calibration Techniques | Education | Long |
Security or Privacy From Hardware to Systems | Education | Long |
Advanced Biomedical Interfaces | Education | Long |