Technical Committees
Analog Circuits and Techniques
Chair: Yaoyao Jia, University Of Texas At Austin
Co-chair: Chilun Lo, Mediatek
Committee Members:
Devrim Aksin, ADI
David Duarte, Intel
Ping-hsuan Hsieh, National Tsing Hua University
Soo Youn Kim, Dongguk University
Antonio Liscidini, University Of Toronto
Jorge Marin, Pontificia Universidad Católica de Valparaíso
Nazanin Neshatvar, Philips
Linxiao Shen, Peking University
Hui Wang, Shanghai Jiao Tong University
Piero Malcovati, University of Pavia
Hui Jiang, Monolithic Power Systems Inc.
Sandeep Reddy Kukunuru, Texas Instruments Inc
Biomedical Technologies and Applications
Chair:Constantine Sideris, University of Southern California
Co-Chair: Kaiyuan Yang, Rice University
Committee Members:
Sungwon Chung Neuralink
Youngcheol Chae “Yonsei University
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Preet Garcha, Texas Instruments
Kyeongha Kwon, KAIST
Kiichi Niitsu, Kyoto University
Rozhan Rabbani, Apple
Sahil Shah, University of Maryland
Soner Sonmezoglu, Northeastern University
Jiawei Xu, Fudan University
Xiaolin Yang, IMEC
Baibhab Chatterjee, University of Florida
Marco Ballini, TDK InvenSense
Saransh Sharma, University of Cambridge
Kwantae Kim, Aalto University
Rajesh Pamula, Medtronic
Qijun Liu, Philips
Data Converters
Chair:Sai-Weng Sin, University of Macau
Co-Chair: Thomas Brown, Intel
Committee Members:
Muhammed Bolatkale, NXP
Friedel Gerfers, TU Berlin
Lu Jie, Tsinghua University
Jin-tae Kim, Konkuk University
Martin Kinyua, TSMC
Guansheng Li, Broadcom
Yong Lim, XO Semiconductor Inc.
Arindam Sanyal, Arizona State University
Zhichao Tan, Zhejiang University
Xiyuan Tang, Peking University
Huseyin Dinc, Analog Devices Inc.
Tsung-Heng Tsai, National Yang Ming Chiao Tung University
Hamid Nejati, Apple
Digital Circuits, SoCs, and Systems
Chair:Shanshan Xie, Intel
Co-Chair: Yoonmyung Lee, Sungkyunkwan University
Committee Members:
Behnam Amelifard, Qualcomm
Ningyuan Cao, University Of Notre Dame
Muya Chang, NVIDIA
Gregory Chen, Intel Corporation
Sumanth Kamineni, Nvidia
Kyuho Jason Lee, Yonsei University
Sukhan Lee, Samsung
Ashwin Lele, TSMC
Yimai Peng, Qualcomm Technologies Inc.
Weiwei Shan, Southeast University
Ekin Sumbul, ArchitectChips
Jong-Hyeok Yoon, Daegu Gyeongbuk Institute of Science and Technology (DGIST)
Kyungmi Lee, Rice University / MIT
Hechen Wang, Multiplier Technologies
Aoyang Zhang, Tsinghua University
Po-Tsang Huang, National Yang Ming Chiao Tung University
Advanced and Emerging Technologies
Chair: Kevin Tien, IBM Quantum
Co-Chair:Juhwan Yoo, Google Quantum AI
Committee Members:
Andrea Ruffino, ETH Zurich
Piergiulio Mannocci, Unconventional AI
Ruud Oldenbeuving, IMEC
Jonathan Proesel, Ciena
Tathagata Srimani, Carnegie Mellon University
Liqiong Wei, Apple
Said Rami, Intel Corp
Vincent Chou, TSMC
Power Management
Chair: Raveesh Magod, Indian Institute of Technology Madras
Co-Chair: Sriharsh Pakala, Renesas
Committee Members:
Soumya Bose, University of California, Santa Cruz
Vincent Chan, Richtek
Reza Erfani, Apple Inc.
Mo Huang, University of Macau
Junmin Jiang, Southern University of Science and Technology
Xiaocheng Jing, Qualcomm ==> Nvidial
Suhwan Kim, Intel
Min-Woo Ko, Intel of Canada
Inhee Lee, University of Pittsburgh
Mauro Leoncini, Politecnico di Milano
Farsheed Mahmoudi, TSMC
Edevaldo Pereira, NXP Semiconductors
Se-Un Shin, Pohang University of Science and Technology (POSTECH)
Cheng Huang, University of Macau
Kamala Raghavan, Sadagopan Qualcomm
Ching-Jan Chen, National Taiwan University
Kang Wei, Texas Instruments
Alessandro Bertolini, STMicroelectronics
Nachiket Desai, NVIDIA
Systems and Security
Chair: Richard Dorrance, Intel
Co-Chair: Maitreyi Ashok ADI
Committee Members:
Debayan Das, Indian Institute of Science
Mingu Kang, University of California San Diego
Monodeep Kar, NVIDIA
Patrick Schaumont, Worcester Polytechnic Institute
Siddharth Joshi, University of Notre Dame
Vikram Suresh, Nvidia
Wireless Transceivers and RF/mm-Wave Circuits and Systems
Chair: Sachin Kalia, K2 Space
Co-Chair: Vadim Isssakov, Braunschweig University of Technology
Committee Members:
Sudipto Chakraborty, IBM Thomas J. Watson Research Center
Wei Deng, Tsinghua University
Hakan Dogan, Infineon Technologies
Najme Ebrahimi, Northeastern University
Hsieh-hung Hsien, TSMC
Juyeop Kim, Samsung Semiconductor
Somnath Kundu, AMD
Sensen Li, UT Austin
Miao Meng, Shanghai Tongji University
Aravind Nagulu, Northeastern University
Satwik Patnaik, Amazon
Mustafijur Rahman, Indian Institute of Technology Delhi
Hamed Rahmani, New York University
Padmanava Sen, Barkhausen-Institut
Kejian Shi, Broadcom
Tong Zhang, Google
Taiyun Chi, Rice University
Yingying Fan, Washington University
Huizhen Jenny Qian, Xidian University
Hao Xu, Fudan University
Hajir Hedayati, Amazon Inc. – Leo
Kang Ning, Sivers Semiconductors
Yogesh Darwhekar, Texas Instruments
Wireline and Optical Communications Circuits and Systems
Chair:Armin Tajalli, University of Utah
Co-Chair:Ajay Balankutty, AMD
Committee Members:
Gain Kim DGIST,
Tawfiq Musah, The Ohio State University
Quan Pan, Southern University of Science and Technology, China
Luca Ravezzi, 2dPhotonics
Minglei Zhang, University of Macau
Henry Park, MediaTek
Laya Mohammadi, Qualcomm
Dan Li Xi’an, Jiaotong University
Heng Zhang, Broadcom
Sitaraman Iyer, Nvidia Corporation
Sashank Krishnamurthy, Indian Institute of Technology Madras