
{"id":238,"date":"2015-07-16T14:59:12","date_gmt":"2015-07-16T21:59:12","guid":{"rendered":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/?page_id=238"},"modified":"2026-05-27T08:14:39","modified_gmt":"2026-05-27T15:14:39","slug":"committees-2","status":"publish","type":"page","link":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/","title":{"rendered":"Steering Committee"},"content":{"rendered":"<div class=\"wpb-content-wrapper\"><p>[vc_row][vc_column width=&#8221;1\/4&#8243;][vc_wp_custommenu nav_menu=&#8221;19&#8243; el_class=&#8221;page-menu&#8221;][\/vc_column][vc_column width=&#8221;3\/4&#8243; el_class=&#8221;contant-page&#8221;]<h2 class=\" \"><span>Steering Committee<\/span><\/h2>[vc_row_inner][vc_column_inner width=&#8221;1\/2&#8243;][vc_column_text css=&#8221;&#8221;]<strong>General Chair<\/strong><\/p>\n<p>Nan Sun, Tsinghua University<br \/>\n<a href=\"mailto:sunnansunny@gmail.com\">sunnansunny@gmail.com<\/a><\/p>\n<p><strong>Conference Chair<\/strong><\/p>\n<p>Carlos Tokunaga, Intel<br \/>\n<a href=\"mailto:carlos.tokunaga@intel.com\">carlos.tokunaga@intel.com<\/a><\/p>\n<p><strong>Technical Program Chair<\/strong><\/p>\n<p>Ulkuhan Guler, Worcester Polytechnic Institute<br \/>\nuguler@wpi.edu<\/p>\n<p><strong>Technical Program Vice-Chair<\/strong><\/p>\n<p>Shenggao Li, TSMC<br \/>\n<a href=\"mailto:shenggao.li@gmail.com\"><span data-sheets-root=\"1\">shenggao.li@gmail.com<\/span><\/a>[\/vc_column_text][\/vc_column_inner][vc_column_inner width=&#8221;1\/2&#8243;][vc_column_text css=&#8221;&#8221;]<strong>Treasurer<\/strong><\/p>\n<p>Sam Palermo, Texas A&amp;M University<br \/>\n<a href=\"mailto:spalermo@tamu.edu\">spalermo@tamu.edu\u00a0<\/a><\/p>\n<p><strong>Past Chairman and Strategic Development Chair<\/strong><\/p>\n<p>Eric Soenen, Micron Technology<br \/>\n<a href=\"mailto:esoenen@micron.com\">esoenen@micron.com<\/a><\/p>\n<p><strong>Solid State Circuits Society Representative<\/strong><\/p>\n<p>Jerald Yoo, Seoul National University<br \/>\n<a href=\"mailto:jerald@snu.ac.kr\" target=\"_blank\" rel=\"noopener\">jerald@snu.ac.kr<\/a><\/p>\n<h4>Conference Coordination<\/h4>\n<p>John Teehan, CMP, DES IEEE CEE<br \/>\n<a href=\"mailto:j.teehan@ieee.org\">j.teehan@ieee.org<\/a><\/p>\n<p><strong>Technical Program\/Paper Information<\/strong><\/p>\n<p><a href=\"mailto:CICCprogram@ieee.org\" target=\"_blank\" rel=\"noopener\">CICCprogram@ieee.org<\/a>[\/vc_column_text][\/vc_column_inner][\/vc_row_inner][\/vc_column][\/vc_row]<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>[vc_row][vc_column width=&#8221;1\/4&#8243;][vc_wp_custommenu nav_menu=&#8221;19&#8243; el_class=&#8221;page-menu&#8221;][\/vc_column][vc_column width=&#8221;3\/4&#8243; el_class=&#8221;contant-page&#8221;]Steering Committee[vc_row_inner][vc_column_inner width=&#8221;1\/2&#8243;][vc_column_text css=&#8221;&#8221;]General Chair<br \/>\nNan Sun, Tsinghua University<br \/>\nsunnansunny@gmail.com<br \/>\nConference Chair<br \/>\nCarlos Tokunaga, Intel<br \/>\ncarlos.tokunaga@intel.com<br \/>\nTechnical Program Chair<br \/>\nUlkuhan Guler, Worcester Polytechnic Institute<br \/>\nuguler@wpi.edu<br \/>\nTechnical Program Vice-Chair<br \/>\nShenggao Li, TSMC<br \/>\nshenggao.li@gmail.com[\/vc_column_text][\/vc_column_inner][vc_column_inner width=&#8221;1\/2&#8243;][vc_column_text css=&#8221;&#8221;]Treasurer<br \/>\nSam Palermo, Texas A&amp;M University<br \/>\nspalermo@tamu.edu\u00a0<br \/>\nPast Chairman and Strategic Development Chair<br \/>\nEric Soenen, Micron Technology<br \/>\nesoenen@micron.com<br \/>\nSolid State Circuits Society Representative<br \/>\nJerald Yoo, &#8230;<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":10,"menu_order":0,"comment_status":"open","ping_status":"open","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-238","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Steering Committee - CICC 2026 Archives<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Steering Committee - CICC 2026 Archives\" \/>\n<meta property=\"og:description\" content=\"[vc_row][vc_column width=&#8221;1\/4&#8243;][vc_wp_custommenu nav_menu=&#8221;19&#8243; el_class=&#8221;page-menu&#8221;][\/vc_column][vc_column width=&#8221;3\/4&#8243; el_class=&#8221;contant-page&#8221;]Steering Committee[vc_row_inner][vc_column_inner width=&#8221;1\/2&#8243;][vc_column_text css=&#8221;&#8221;]General Chair Nan Sun, Tsinghua University sunnansunny@gmail.com Conference Chair Carlos Tokunaga, Intel carlos.tokunaga@intel.com Technical Program Chair Ulkuhan Guler, Worcester Polytechnic Institute uguler@wpi.edu Technical Program Vice-Chair Shenggao Li, TSMC shenggao.li@gmail.com[\/vc_column_text][\/vc_column_inner][vc_column_inner width=&#8221;1\/2&#8243;][vc_column_text css=&#8221;&#8221;]Treasurer Sam Palermo, Texas A&amp;M University spalermo@tamu.edu\u00a0 Past Chairman and Strategic Development Chair Eric Soenen, Micron Technology esoenen@micron.com Solid State Circuits Society Representative Jerald Yoo, ...\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/\" \/>\n<meta property=\"og:site_name\" content=\"CICC 2026 Archives\" \/>\n<meta property=\"article:modified_time\" content=\"2026-05-27T15:14:39+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/about-cicc\\\/committees-2\\\/\",\"url\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/about-cicc\\\/committees-2\\\/\",\"name\":\"Steering Committee - CICC 2026 Archives\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/#website\"},\"datePublished\":\"2015-07-16T21:59:12+00:00\",\"dateModified\":\"2026-05-27T15:14:39+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/about-cicc\\\/committees-2\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/about-cicc\\\/committees-2\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/about-cicc\\\/committees-2\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"About CICC\",\"item\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/about-cicc\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Steering Committee\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/#website\",\"url\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/\",\"name\":\"IEEE CICC\",\"description\":\"CICC 2026\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.ieee-cicc.org\\\/cicc2026archives\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Steering Committee - CICC 2026 Archives","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/","og_locale":"en_US","og_type":"article","og_title":"Steering Committee - CICC 2026 Archives","og_description":"[vc_row][vc_column width=&#8221;1\/4&#8243;][vc_wp_custommenu nav_menu=&#8221;19&#8243; el_class=&#8221;page-menu&#8221;][\/vc_column][vc_column width=&#8221;3\/4&#8243; el_class=&#8221;contant-page&#8221;]Steering Committee[vc_row_inner][vc_column_inner width=&#8221;1\/2&#8243;][vc_column_text css=&#8221;&#8221;]General Chair Nan Sun, Tsinghua University sunnansunny@gmail.com Conference Chair Carlos Tokunaga, Intel carlos.tokunaga@intel.com Technical Program Chair Ulkuhan Guler, Worcester Polytechnic Institute uguler@wpi.edu Technical Program Vice-Chair Shenggao Li, TSMC shenggao.li@gmail.com[\/vc_column_text][\/vc_column_inner][vc_column_inner width=&#8221;1\/2&#8243;][vc_column_text css=&#8221;&#8221;]Treasurer Sam Palermo, Texas A&amp;M University spalermo@tamu.edu\u00a0 Past Chairman and Strategic Development Chair Eric Soenen, Micron Technology esoenen@micron.com Solid State Circuits Society Representative Jerald Yoo, ...","og_url":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/","og_site_name":"CICC 2026 Archives","article_modified_time":"2026-05-27T15:14:39+00:00","twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/","url":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/","name":"Steering Committee - CICC 2026 Archives","isPartOf":{"@id":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/#website"},"datePublished":"2015-07-16T21:59:12+00:00","dateModified":"2026-05-27T15:14:39+00:00","breadcrumb":{"@id":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/committees-2\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/"},{"@type":"ListItem","position":2,"name":"About CICC","item":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/about-cicc\/"},{"@type":"ListItem","position":3,"name":"Steering Committee"}]},{"@type":"WebSite","@id":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/#website","url":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/","name":"IEEE CICC","description":"CICC 2026","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"}]}},"_links":{"self":[{"href":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/wp-json\/wp\/v2\/pages\/238","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/wp-json\/wp\/v2\/comments?post=238"}],"version-history":[{"count":0,"href":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/wp-json\/wp\/v2\/pages\/238\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/wp-json\/wp\/v2\/pages\/10"}],"wp:attachment":[{"href":"https:\/\/www.ieee-cicc.org\/cicc2026archives\/wp-json\/wp\/v2\/media?parent=238"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}