{"id":2335,"date":"2016-10-03T09:52:13","date_gmt":"2016-10-03T16:52:13","guid":{"rendered":"https:\/\/www.ieee-cicc.org\/2025archive\/?page_id=2335"},"modified":"2025-04-13T13:52:50","modified_gmt":"2025-04-13T20:52:50","slug":"technical-committees","status":"publish","type":"page","link":"https:\/\/www.ieee-cicc.org\/2025archive\/about-cicc\/technical-committees\/","title":{"rendered":"Technical Committees"},"content":{"rendered":"

[vc_row][vc_column width=”1\/4″][vc_wp_custommenu nav_menu=”19″ el_class=”page-menu”][\/vc_column][vc_column width=”3\/4″ el_class=”contant-page”]

Technical Committees<\/span><\/h2>[vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text css=””]Analog Circuits and Techniques<\/strong><\/p>\n

Chair:<\/strong> Ping-hsuan Hsieh, National Tsing Hua University<\/p>\n

Co-chair:<\/strong> Anne-Johan Annema, University of Twente<\/p>\n

Committee Members:<\/strong><\/p>\n

Devrim Aksin, ADI
\nEdoardo Bonizzoni, University Of Pavia
\nDavid Duarte, Intel
\nSoo Youn Kim, Dongguk University
\nAntonio Liscidini, University of Toronto
\nChilun\u00a0 Lo, Mediatek
\nJorge Marin, Advanced Center for Electrical and Electronic Engineering, Chile
\nNazanin Neshatvar, University College London
\nLinxiao Shen, Peking University<\/p>\n

Biomedical Technologies and Applications<\/strong><\/p>\n

Chair: <\/strong>Chul Kim, KAIST<\/p>\n

Co-Chair:<\/strong> Sungwon Chung, Neuralink<\/p>\n

Committee Members:<\/strong><\/p>\n

Youngcheol Chae, Yonsei University, Seoul Korea
\nYaoyao Jia, University Of Texas At Austin
\nKyeongha Kwon, KAIST
\nShih-Chii Liu, University of Zurich and ETH Zurich
\nKiichi Niitsu, Kyoto University
\nSahil Shah, University of Maryland
\nConstantine Sideris, University of Southern California
\nSoner Sonmezoglu, Northeastern University
\nJiawei\u00a0 Xu, Fudan University
\nKaiyuan Yang, Rice University
\nXiaolin Yang, IMEC<\/p>\n

Data Converters<\/strong><\/p>\n

Chair: <\/strong>Qiang Li, University of Electronic Science and Technology of China<\/p>\n

Co-Chair: <\/strong>Sai-Weng Sin, University of Macau<\/p>\n

Committee Members:<\/strong><\/p>\n

Thomas Brown, Intel
\nChia-hung Chen, National Yang Ming Chiao Tung University
\nFriedel \u00a0Gerfers, TU Berlin
\nLu Jie, Tsinghua University
\nJin-tae Kim, Konkuk University
\nMartin Kinyua, TSMC
\nShaolan Li, Georgia Institute of Technology
\nYong Lim, Samsung
\nYong Liu, Broadcom
\nZhichao Tan, Zhejiang University
\nHaiyang (Henry) Zhu, ADI<\/p>\n

Digital Circuits, SoCs, and Systems<\/strong><\/p>\n

Chair: <\/strong>Divya Prasad, AMD<\/p>\n

Co-Chair: <\/strong>Visvesh Sathe, Georgia Institute of Technology<\/p>\n

Committee Members:<\/strong><\/p>\n

Behnam Amelifard, Qualcomm
\nNingyuan Cao, University of Notre Dame
\nMuya Chang, NVIDIA
\nGregory Chen, Intel Corporation
\nJie Gu, Northwestern University
\nBongjin Kim, University of California, Santa Barbara
\nSukhan \u00a0Lee, Samsung
\nYoonmyung Lee, Sungkyunkwan University
\nAshwin Lele, TSMC
\nWeiwei Shan, Southeast University
\nElkim Roa, Samsung Semiconductor
\nThierry Tambe, Sanford University
\nShanshan Xie, Intel
\nJong-Hyeok Yoon, DGIST
\nSumanth Kamineni, Nvidia[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_column_text css=””]Emerging Technologies<\/strong><\/p>\n

Chair: <\/strong>Win-san (Vince) Khwa, TSMC<\/p>\n

Co-Chair: <\/strong>Andrea Ruffino, ETH Zurich<\/p>\n

Committee Members:<\/strong><\/p>\n

Guillaume Prenat, CEA, France
\nTathagata Srimani, Carnegie Mellon University
\nKevin Tien, IBM
\nLiqiong Wei, Intel
\nJuhwan Yoo, Google Quantum AI<\/p>\n

Power Management<\/strong><\/p>\n

Chair:\u00a0 <\/strong>Hyun-Sik Kim, KAIST<\/p>\n

Co-Chair: <\/strong>Cheng Huang, Iowa State University<\/p>\n

Committee Members:<\/strong><\/p>\n

Mo Huang, University of Macau
\nXiaocheng Jing, Qualcomm
\nSuhwan Kim, Intel
\nMin-Woo Ko, Intel of Canada
\nInhee Lee, University of Pittsburgh
\nMauro\u00a0 Leoncini, Politecnico di Milano
\nRaveesh Magod, Texas Instruments
\nSriharsh Pakala, NXP Semiconductors
\nEdevaldo Pereira, NXP Semiconductors
\nAlan Roth, TSMC<\/p>\n

Systems and Security<\/strong><\/p>\n

Chair: <\/strong>Zhengya Zhang, University of Michigan<\/p>\n

Co-Chair: <\/strong>Siddharth Joshi, University of Notre Dame<\/p>\n

Committee Members:<\/strong><\/p>\n

Baibhab\u00a0Chatterjee, University of Florida
\nDebayan Das, Indian Institute of Science
\nXinfei Guo, Shanghai Jiao Tong University
\nMingu Kang, UCSD
\nMonodeep Kar, IBM
\nRaghavan Kumar, Intel
\nFarhana Sheikh, Intel<\/p>\n

Wireless Transceivers and RF\/mm-Wave Circuits and Systems<\/strong><\/p>\n

Chair: <\/strong>Sudipto Chakraborty, IBM<\/p>\n

Co-Chair:<\/strong> Taiyun Chi, Rice University<\/p>\n

Committee Members:<\/strong><\/p>\n

Hamidreza Agahsi, University of California Irvine
\nRitesh Bhat, Intel
\nNajme Ebrahimi, Northeastern University
\nWei Deng, Tsinghua University
\nHsieh-hung Hsien, TSMC
\nVadim Isssakov, Braunschweig University of Technology
\nSachin Kalia, TI
\nSomnath Kundu, AMD
\nAravind \u00a0Nagulu, Washington University in St. Louis
\nMark Oude Alink, University of Twente
\nMustafijur Rahman, IIT Delhi
\nHamed Rahmani, New York University
\nPadmanava Sen, Barkhausen-Institut
\nTong Zhang, Google<\/p>\n

Wireline and Optical Communications Circuits and Systems<\/strong><\/p>\n

Chair: <\/strong>Tejasvi Anand, Oregon State University<\/p>\n

Co-Chair: <\/strong>Shenggao (victor) Li, TSMC<\/p>\n

Committee Members:<\/strong><\/p>\n

Ajay Balankuty, Intel
\nXi Chen, Nvidia
\nTawifq Musah, The Ohio State University
\nQuan Pan, Southern University of Sicence and Technology, China
\nHenry Park, MediaTek
\nLuca Ravezzi, AMD
\nArmin Tajalli, University of Utah
\nHaitao Tong, Broadcom[\/vc_column_text][\/vc_column_inner][\/vc_row_inner][\/vc_column][\/vc_row]<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"

[vc_row][vc_column width=”1\/4″][vc_wp_custommenu nav_menu=”19″ el_class=”page-menu”][\/vc_column][vc_column width=”3\/4″ el_class=”contant-page”]Technical Committees[vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text css=””]Analog Circuits and Techniques
\nChair: Ping-hsuan Hsieh, National Tsing Hua University
\nCo-chair: Anne-Johan Annema, University of Twente
\nCommittee Members:
\nDevrim Aksin, ADI
\nEdoardo Bonizzoni, University Of Pavia
\nDavid Duarte, Intel
\nSoo Youn Kim, Dongguk University
\nAntonio Liscidini, University of Toronto
\nChilun\u00a0 Lo, Mediatek
\nJorge Marin, Advanced Center …<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":10,"menu_order":1,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-2335","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"\nTechnical Committees - CICC 2025 Archive<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ieee-cicc.org\/2025archive\/about-cicc\/technical-committees\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Technical Committees - CICC 2025 Archive\" \/>\n<meta property=\"og:description\" content=\"[vc_row][vc_column width=”1\/4″][vc_wp_custommenu nav_menu=”19″ el_class=”page-menu”][\/vc_column][vc_column width=”3\/4″ el_class=”contant-page”]Technical Committees[vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text css=””]Analog Circuits and Techniques Chair: Ping-hsuan Hsieh, National Tsing Hua University Co-chair: Anne-Johan Annema, University of Twente Committee Members: Devrim Aksin, ADI Edoardo Bonizzoni, University Of Pavia David Duarte, Intel Soo Youn Kim, Dongguk University Antonio Liscidini, University of Toronto Chilun\u00a0 Lo, Mediatek Jorge Marin, Advanced Center ...\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ieee-cicc.org\/2025archive\/about-cicc\/technical-committees\/\" \/>\n<meta property=\"og:site_name\" content=\"CICC 2025 Archive\" \/>\n<meta property=\"article:modified_time\" content=\"2025-04-13T20:52:50+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.ieee-cicc.org\\\/2025archive\\\/about-cicc\\\/technical-committees\\\/\",\"url\":\"https:\\\/\\\/www.ieee-cicc.org\\\/2025archive\\\/about-cicc\\\/technical-committees\\\/\",\"name\":\"Technical Committees - 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