Analog Circuit
Design:
Amplifiers, voltage references and regulators,opamps, sample-and-hold circuits, continuous and discrete-time filters, oversampled and Nyquist-rate data converters, non-linear
analog circuits, mixed analog/digital IC applications, analog circuits for sensor interfaces, low-voltage/low-power analog, and deep submicron issues in analog design.
Biomedical, Sensors, Displays, and MEMS:
Emerging technologies for sensors, displays, MEMS, and biomedical applications including materials, and methodologies. Examples include nanotechnology, microchemical
sensors, biosensors and devices, image sensors, OLED’s, DNA microarrays, carbon nanotubes, micro- and nanofluidic chips, novel display technologies and plastic circuitry. Alternative
techniques for energy scavenging using photovoltaic and electrochemical sources.
Digital and Mixed Signal SOC/ASIC/SIP:
Solutions to today’s complex digital and mixed-signal design problems, in particular practical examples and case studies involved with system level design using
SoC/ASICs/SiPs (“how we did it”). Digitizing analog functions that are difficult to design as technology processes scale. Interfacing analog and digital in the same chip
including testing. Issues with large digital designs including power management, clocking and what to do when synthesis breaks. Examples of using SIP for a system solution.
Embedded Memory:
Memory circuits, architectures, and methodologies addressing scalability, GHz performance, manufacturability, reliability, and the advancement of emerging memory technologies.
Also of interest are redundancy, BIST, SER, cell stability, and low voltage/leakage design.
Manufacturing:
Special focus on challenges of and alternatives to CMOS scaling, Design for Manufacturability, cost-effective manufacturing techniques, design impact of process-technology selection or packaging.
Advanced manufacturing techniques using any combination of bulk/SOI CMOS, bipolar, non-silicon, and optoelectronics technologies. Evolving chip packaging such as chip stacking, lead-free, flip-chip,
and System-in-Package. Tutorial papers are encouraged.
Power Management:
Analog and digital circuit design for limiting integrated circuit power dissipation and power management. Circuits and architectures to limit active and standby power dissipation in
digital circuits and memories. Advanced low power AC/DC, DC/DC converters, regulators, regulator control, and IO circuits. Integrated circuits implementing energy scavenging and power
harvesting techniques. Systems implementing wireless power transmission, e.g., biomedical implants.
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Programmable Devices:
Logic block, routing fabric, system architecture, and circuit design for FPGAs, PLDs, and structured arrays. Programmable I/O structures, configurable cores, interaction between configurable
logic and processors/memories/fixed-function cores. Programmable analog architectures. CAD tools targeting these devices. Power efficient architecture, power modeling and optimization for
programmable devices. Architecture and CAD for nano-scale FPGAs.
Simulation and Modeling:
Compact active and passive device models, behavioral modeling, and signal integrity modeling and simulation. Parasitic extraction and reduction. Simulation techniques for analog, RF, and mixed-signal circuits.
Package modeling. Process variation, statistical, and reliability modeling. Compact models for extreme environment operation. SOI and multiple gate device modeling.
Test, Characterization, Debug, and Reliability:
Design for test/manufacturability/reliability, built-in-self-test for IC system and low cost test techniques, design for at speed test, RF characterization and production test, jitter characterization and
manufacturing test for high speed SerDes, hardware and firmware IC debug and diagnosis, new reliability and failure mechanisms in nanometer technologies, ESD protection, latch-up and soft errors.
Tutorial papers in the areas of debug and diagnosis, and high speed serial I/O testing are encouraged.
Wired Communications:
Circuits and systems for electrical and optical networks, including; peripheral IO buses, LAN, WAN, Ethernet, SONET, xDSL, SATA, HDMI, PCIe, USB, cable modems, power-line/phone-line
home networks, serial links, backplane, high-speed memory and graphic interfaces, chip-to-chip interconnects, clocking and high-speed low-power blocks for broadband applications. Circuit blocks
including Gbps-ESD, Serializers/Deserializers, Equalizers, PLLs, DLLs, CDRs, Oscillators, Drivers and Amplifiers.
Wireless Designs:
Integrated wireless transceiver architectures and sub-circuits for cellular, connectivity, broadband and millimeter-wave communication, low-power and biomedical, smart antennas and MIMO,
software-defined radio. Papers on RF circuit solutions targeting emerging wireless applications and techniques are particularly encouraged.
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