Ting Wu received the B.E. degree in electronic engineering from Tsinghua University, Beijing, China, in 2000, the M.Phil. degree in electrical and electronic engineering from Hong Kong University of Science and Technology, Hong Kong, in 2003, and the Ph.D. degree in electrical and computer engineering from Oregon State University, Corvallis, OR, in 2007. He worked at Via Technologies Inc., Beijing, China, in 2003, and was with Broadcom Corporation, Irvine, CA, during summer 2004. Since February 2007, he has been with Rambus Inc., Los Altos, CA, as a Sr. Member of Technical Staff. His current research interests are in CMOS integrated circuits and systems for wired and wireless communications.