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Muhannad S.
Bakir received the B.E.E. degree from Auburn University,
Auburn, AL, in 1999 and the M.S. and PhD
degrees in Electrical Engineering from the Georgia Institute of
Technology (Georgia Tech) in 2000 and 2003, respectively.
He is currently a Research Engineer II at the Microelectronics
Research Center
and Adjunct Professor in the School
of Electrical and
Computer Engineering at Georgia Tech. His areas of interest include
integrated (electrical, optical, fluidic) I/O interconnections for 3D gigascale systems and nanofabrication technology.
He has published more than 45 refereed and invited publications that
appear in conference proceedings and journals and holds eight US
patents. Dr. Bakir has presented a conference
tutorial at the 2006 IEEE System-on-a-Chip Conf. (SoCC) and an invited forum presentation on 3D
technology at the 2007 IEEE Int. Solid-State Circuits Conf.
(ISSCC).
He is a (co)recipient of the Best Conference Paper award from the 2002 Electronic
Components and Technology Conference (ECTC), the Best Student Paper
awards from the 2005 and 2006 IEEE Int. Interconnect Technology
Conference (IITC), and the Best Invited Paper Award from the 2007 IEEE Custom Integrated Circuits Conf.
(CICC). He serves as a committee member for the IEEE LEOS Annual Meeting. He is also a member of the International Technology Roadmap for
Semiconductors (ITRS) technical working group for Assembly and Packaging (AP).
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