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Technical
Program
Educational Sessions
Keynote Address
Conference Luncheon
Panel Discussions
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On Tuesday afternoon, September 20, CICC will offer a Panel Discussion.
Cedar Room
2:00pm – 4:00 pm
Session 17 (Panel Discussion)
Can Heterogeneous MCM Solutions
Kill 3D-ICs in Their Infancy?
3D integration improves circuit density and offers a solution to continue on the performance-growth path of Moore’s law. 3D-ICs based on vertical integration with TSVs are a promising alternative but not the only one.
Heterogeneous integration techniques of multiple ICs such as SiP, silicon-carrier and 3D packaging are becoming mature. Will these alternatives eliminate TSV-based 3D-ICs before their implementation challenges are solved?
A panel of experts and industry leaders discusses the promises and hurdles associated with different multi-dimensional integration techniques.
Chair:
Dr. Alberto Valdes-Garcia, Research Staff Member, IBM T. J. Watson Research Center
Moderator:
Prof. Rao Tummala, Director, Microsystems Packaging Research Center, Georgia Institute of Technology
Panelists:
Dr. Pol Marchal, Program Manager for 3D Design Technology, IMEC
Dr. John Osenbach, Fellow, Materials and Interconnect Technology World Wide Manufacturing, LSI Company
Mr. Robert Patti, CTO and VP of Design Engineering, Tezzaron Semiconductor
Dr. Rajendra D. Pendse, VP, Advanced Products and Technology Marketing, STATSChipPAC
Dr. Christian Val, Founder & CEO, 3D Plus
Dr. Subramanian Iyer, Fellow, IBM Systems & Technology Group
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