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CICC 2000 Technical Program: Tuesday, May 23 - Afternoon

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Tuesday, May 23 - Afternoon


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Session 13 - Panel Discussion: Timing Closure - Can Synthesis and Physical Design REALLY Get Along?

2:00pm

Organizer:
Paul Wiley, Texas Instruments

Panelists:
Jacques Benkoski, Monterrey Design Systems
David Dick, Fujitsu
Joe Hutt, Magma Design Automation
David Lackey, IBM Microelectronics
Anthony J. Lell, Texas Instruments
Stephen Meier, Synopsys

For the last couple of years, EDA vendors have been making big claims for new "timing-closure" flows. These flows will enable designers to meet timing constraints with drastically fewer iterations between synthesis and physical design. The flows will also help designers satisfy noise, electromigration, and power constraints. The flows promise a drastic increase in design productivity.

Design engineers, on the other hand, are still iterating, still having problems employing timing-driven physical design flows, still formulating workarounds for stupid tool limitations. Design engineers are skeptical of the claims from EDA vendors. What's the real story? This panel brings together representatives from the EDA industry and practicing design engineers to elaborate on the different perspectives.


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Session 14 - High-Speed Data Communication/Storage Circuits

Chairman: Sang-Soo Lee
Co-Chairman Fang Lu

This session features signal-processing techniques on advanced communication and storage ICs. Papers in this session includes chips for ADSL, cable modem, SDH/PDH, HDD read/write channel, power-line FSK transceiver, and on-chip isolated AFE for V.90 modem applications.

2:00pm - Introduction


14.1 - 2:05pm
A CMOS ADSL Codec for Central Office Applications
P. Siniscalchi, J. Pitz, R. Hester, S. DeSoto, M. Wang, S. Sridharan, R. Halbach, D. Richardson, W. Bright, M. Sarraj, J. Hellums, C. Betty and G. Westphal, Texas Instruments, Inc., Dallas, TX

Abstract : A CMOS central office codec that supports Full Rate and G.Lite ADSL applications is described. The transmit channel consists of application-dependent digital filters, a 14 bit, 8.832 MSample/s DAC, a 1.104 MHz analog filter and programmable attenuation. The receive channel contains programmable gains, analog and digital low-pass filters and a 14 bit, 2.208 MSample/s pipeline ADC. The IC dissipates 450 mW from 3.3 V.


14.2 - 2:30pm
A 4 Channel Analog Front End for Central Office ADSL Modems
J. Kenney, F. Sabouri, V. Leung, J. Guido, E. Zimany, A. Agrillo, J. Trackim, J. Khoury* and R. Shariatdoust, Analog Devices, Inc., Somerset, NJ and *Lucent Technologies, Allentown, PA

Abstract : This chip integrates a 4 channel analog front-end for central office ADSL modems. The receive path has a programmable gain amplifier (PGA) with 30 dB of range followed by a fourth-order 2-bit sigma-delta modulator clocking at 35MHz. The transmit path uses a 14-bit current steering D/A converter followed by a fourth-order low-pass filter. The device is implemented in 0.35um CMOS and consumes less than 160 mW per channel. It is packaged in a 100 pin MQFP package.


14.3 - 2:55pm
A Single-Chip Universal Burst Receiver for Cable Modem/Digital Cable-TV Applications
F. Lu, J. Min, S. Liu, K. Cameron, C. Jones, O. Lee, J. Li, A. Buchwald, S. Jantzi, C. Ward, K. Choi, J. Searle and H. Samueli, Broadcom Corp., Irvine, CA

Abstract : This paper presents a single-chip cable upstream receiver which demodulates QPSK/16-QAM burst data in a frequency-agile, time-division multiple access (TDMA) scheme. An analog front end (AFE), an all-digital receiver and an FEC decoder are integrated on chip. The AFE performs coarse gain setting and signal quantization on either an IF input or baseband I/Q inputs. The digital QAM receiver contains a quadrature down-mixer, multi-stage decimators, Nyquist filters, carrier/timing acquisition loops, and an adaptive equalizer. The FEC decoder consists of a programmable descrambler and a versatile Reed-Solomon decoder. The chip occupies 4.7 x 7.8 mm2 die area in a 0.35-um CMOS process, and consumes 1.0 W at 3.3 V in a 100-pin PQFP.


14.4 - 3:20pm
A Single Chip 155Mbps/140Mbps SDH/PDH Transceiver
J. Guinea, L. Tomasini, S.Maggio* and M. Rutar*, ST Microelectronics, Agrate, Italy and *Alcatel Italia, Vimercate, Italy

Abstract : The 155Mbps (STM-1electrical) transceiver complies with relevant ITU-T recommendations. The transmiter features CMI transmission (transformerless) with specified Jitter-generation. On the receiver, Jitter-tolerance and Bit-error-rate performance is attained. The cable equalizer supports 13.7dB loss (Nyquist-frequency) with an eye-closure less than 600psec. Device uses one master-clock (155MHz) and a DLL for TX and RX synchronization. Targetted crosstalk isolation is reached with 0.35um BiCMOS technology. The TQFP48 IC powered from 3.3V consumes 390mW.


14.5 - 3:45pm
A 450Mbit/s Parallel Read/Write Channel with Parity Check and 16-State Time Variant Viterbi
G. Bollati, A. Dati, G. Betti, I. Bietti, F. Brianti, M. Bruccoleri, M. Coltella, P. Demartini, M. Demicheli, P.Gadducci, S. Marchese, D. Ottini, V. Pisati, F. Rezzi, A. Rossi, P. Savo, C. Tonci and R. Castello*, STMicroelectronics, Milan, Italy and *Universita'di Pavia, Pavia, Italy

Abstract : A PRML Read/Write IC operating up to 450Mbit/s is presented. The chip implements a 16-state EPR4 Parity Check Time Variant Viterbi detector and a digital servo. A 24/26 code with parity check improves the robustness to white noise, media noise and to off-track operations. The device is integrated in a mature 0.35um technology with a die size of 13mm2 and dissipates 1.9W in Read Mode at 450Mbit/s.


14.6 - 4:10pm
A Versatile Low-Power Power Line FSK Transceiver
R. Cappelletti and A. Baschirotto*, STMicroelectronics, Cornaredo, Italy and *University of Leece, Leece, Italy

Abstract : The operations of a Power-Line-Modem are controlled by an internal 24bit register in order to satisfy the requirement of several protocols for power-line communications and home automation. The PLM, realized in a 0.6um BCD-technology, from a 9V supply, in Tx mode, delivers 1W on 16ohms, while in Rx mode it consumes 3.5mA.


14.7 - 4:35pm
An Analog Front-End LSI with On-Chip Isolator for V.90 56kbps Modems
N. Kanekawa, Y. Kojima, S. Yokutake, N. Minehiro, T. Iwasaki, K. Takami, Y. Takeuchi*, A. Yano* and Y. Shima*, Hitachi Res. Lab, Ibaraki, Japan and *Device Development Center, Tokyo, Japan

Abstract : This paper presents an Isolated Analog Front-End (I-AFE) LSI with built-in isolation function for V.90, 56kbps modems. The LSI has 1.5kVrms. AC isolation and analog front-end functions. The on-chip isolation approach eliminates external isolation devices such as transformers or photo-couplers.


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Session 15 - Radio Integration: Architecture, Components and Technology

Chairman: Trudy Stetzler
Co-Chairman Georges Gielen

This session focuses on integration trends in wireless systems and the impact of CMOS technology trends on RF circuits. Examples include a novel CMOS T/R switch, new approaches to integrated transformers and techniques to reduce substrate noise.

2:00pm - Introduction


15.1 - 2:05pm
Silicon Radio Integration: Architectures and Technology: From Cartesian Zero IF Receive & Transmit to Polar Zero I and Q, From Silicon Bipolar to Bulk and SOI CMOS (Invited)
J. Sevenhans, Antwerp, Belgium

Abstract :  


15.2 - 2:55ppm
A 900-MHz T/R Switch with a 0.8-dB Insertion Loss Implemented in a 0.5-um CMOS Process
F. Huang and K. O., University of Florida, Gainesville, FL

Abstract : A single-pole, double-throw transmit/receive switch for 3.0-V applications has been fabricated in a 0.5-um CMOS process. The switch exhibits a 0.8-dB insertion loss and a 17-dBm P1dB. The low insertion loss is achieved by optimizing the transistor widths and bias voltages, and by minimizing the substrate resistances, while the high 1dB compression point is achieved by dc biasing the input and output nodes.


15.3 - 3:20ppm
Stacked Inductors and 1-to-2 Transformers in CMOS Technology
A. Zolfaghari, A. Chan and B. Razavi, University of California, Los Angeles, CA

Abstract : A modification of stacked spiral inductors increases the self-resonance frequency by 100% with no additional processing steps, yielding values of 5 nH to 266 nH and self-resonance frequencies of 11.2 GHz to 0.5 GHz. Closed-form expressions predicting the self-resonance frequency with less than 5% error have also been developed. A 1-to-2 transformer consisting of 3 stacked spirals achieves a voltage gain of 1.8 at 2.5 GHz. The structures have been fabricated in standard CMOS technologies with four and five metal layers.


15.4 - 3:45pm
An Integrated Capacitively Coupled Transformer and Its Application for RF IC's
L.-P. Wong, C. Snyder, T. Manku and S. Kovacic*, University of Waterloo, Waterloo, Canada and *SiGe Microsystems, Inc., Ottawa, Canada

Abstract : This paper describes a low voltage topology that uses a capacitively coupled transformer element. The structure is used to design a 1V LNA at 1.9GHz. The LNA consumes 4mA of current has an IP3in of -4.5dBm, a NF50 of 2.3dB, a NFmin of 1.9dB, and a gain of 10.1dB.


15.5 - 4:10pm
Measuring and Modeling the Effects of Substrate Noise on the LNA for a CMOS GPS Receiver
M. Xu, D. Su, D. Shaeffer, T. Lee and B. Wooley, Stanford University, Stanford, CA

Abstract : The influence of substrate noise generated in digital circuit on the low-noise amplifier (LNA) of a CMOS GPS receiver has been experimentally characterized and theoretically analyzed. A frequency domain approach is used to model noise injection into the substrate from the digital circuitry and the mechanisms by which that noise can affect analog circuit behavior. The results reveal that substrate noise can modulate the LNA input signals as well as directly couple to the LNA output.


15.6 - 4:35pm
Active Substrate Noise Suppression In Mixed-Signal Circuits Using On-Chip Driven Guard Rings
W. Winkler and F. Herzel, Institute for Semiconductor Physics, Frankfurt, Germany

Abstract : The paper presents an active substrate noise suppression circuit using a pair of concentric guard rings. A SiGe on-chip amplifier injects inverted substrate noise such that efficient noise cancellation is achieved. A ring oscillator is used to sense the residual substrate noise. The measured noise suppression bandwidth is as high as 400 MHz.


15.7 - 5:00pm
Impact of Technology Scaling on CMOS RF Devices and Circuits
E. Abou-Allam, T. Manku, M. Ting and M. Obrecht, University of Waterloo, Waterloo, Canada

Abstract : Devices from 0.18um, 0.25um, 0.35um, 0.5um, and 0.8um CMOS technologies are characterized and compared in terms of their RF performance. The ratio of transconductance to bias current (gm/Ids) becomes higher as the device length gets smaller. A 1V receiver front-end is designed, the LNA has 1.7 dB noise figure and 14 dB gain and the mixer has an IIP3 of 11 dBm. The power dissipation is 33mW and 6mW for the 0.5um and 0.18um receivers, respectively.


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